Haosens Technology Co., Ltd

Assembly type�SMT�DIP�AI�COB � 0201�Micro BGA SMT p

Layer: 1-8 layers flex PCB�Flex-RIGID PCB �4-8 Layers) Material: Polyimide �

FR4 Thickness: 1.6mm Copper thickness of out layer: 35um 2 layers Surface treatment: HALSN100C

Layer: 1-16 layers Rigid PCBã��HDI Material: 94V0ã��CEM1ã��FR4ã��HIGH TGï&fr

Our PCB Technical Specifications: - Base material: FR4, Aluminum, Ceramic, Rogers, F4BK, F4BT, TP, PF, CEM

We offer full service of SMT PCBA, 1. Our professional engineering team can put your project into production

14-layer multilayer PCB Aspect ratio: 18:1 Drill bit: 0.20mm (minimum) Board thickness: 3.6mm Line width a

Layer: 1-24 layers Rigid PCBã��HDI Material: 94V0ã��CEM1ã��FR4ã��HIGH TGï&fr

Our company is engaged in Reliable OEM / ODM PCB assembly services for electronic applications. Main Produc

Base material: FR4, Aluminum, Ceramic, Rogers, F4BK, F4BT, TP, PF, CEM-1, CEM-3, High TG, etc. - Board thick

Layers count: 8 layers Thickness: 1.0 mm Blind layersL1-L4 and L5-L8 Finish: gold-plate + finger(30u")

Assembly type: SMT/DIP/AI/COB ***** BGA SMT placement capability -Conventional manually-Insertion Assembl

Specializing in Double Side PCB, Multi-Layer PCB, F4BK PCB, Ceramic PCB, Rogers PCB, Aluminum PCB. Layer: 8

Base material: FR4, FR1, FR2, Ceramics, Aluminum, Rogers, F4B, F4BK, F4BT, TP, PF, CEM-1, CEM-3, etc. Board t

LCD Type: TN, HTN, STN, FSTN, FFSTN, VA, NBT Module Type: ASM, TAB, COB, COG, COF Display Type: Segment, C

Number of layers: 2 to 6 layers flexible PCB Maximum board size: 10 x 15 inches Material: PI Board thi

*****: FR4 2.board thickness: 1.6mm 3.solder mask: Green, blue 4.Surface finish: ENIG+gold

Layers: 1 to 16 Materials: FR-4, CEM-1, aluminum, rogers, laconic, GETEK, and arlon Finish board thickness:

Number of layers: 2 to 16 layers rigid multilayer PCB Maximum board size: 20.5 x 24.1 inches Material: C

Four-layer PCB Total thickness: 1.6mm Impedance control Gold finish Used for alarm systems With UL a