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联系人 Mr. Huang
No.205, Hongdu Office Building, Fanshen Road, ShenZhen, Guangdong
Key Specifications/Special Features: Layer number: 8 Surface finished: ENIG+OSP Board thickness: 0.8mm Array size: 3.**3 x 6.***-inch Thru via size: 0.3mm Application: mobile phone HDI structure: 2 x 4 x 2 (staggered via) Minimum BGA ball pitch: **0um Minimum SMD pad pitch: **0um Material type: FR4, NTG Minimum line width: **0um Minimum line space: **0um
