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Dawn Technologies (HK) Limited

No.205, Hongdu Office Building, Fanshen Road,ShenZhen,Guangdong,China China

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主页 公司名称 Dawn Technologies (HK) Limited 销售信息

销售信息: 20

Sell Flexible PCB with FR4 Stiffner
Sell Flexible PCB With FR4 Stiffner

Key Specifications/Special Features: Base material: polyamide and copper Foldaway space-saving and lightw

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Sell Double Sided FPC
Sell Double Sided FPC

Key Specifications/Special Features: Base materials: 0.5oz Cu, 1mil PI and 1mil ADH Minimum hole size: di

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Sell Flexible PCB with Aluminum Board Reinforce
Sell Flexible PCB With Aluminum Board Reinforce

Key Specifications/Special Features: Number of layers: 2 Flex CCL: 1.0 oz ED copper and 1.0 mil PI with 2

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Sell 6-layer HDI PCB For Telecom-1
Sell 6-layer HDI PCB For Telecom-1

Key Specifications/Special Features: Layers: 6 Surface finish: ENIG + OSP Board thickness: 1.0+/-0.1mm

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8 Layer Rigid Flex PCB
8 Layer Rigid Flex PCB

8-layer Rigid-flex PCB 8 layer flex-rigid board 8-layer Rigid-flex PCB Made of FR4 Key Specifications/Speci

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Sell Flexible PCB
Sell Flexible PCB

Key Specifications/Special Features: Flexible PCB with hollowed-out structure Surface finish: plating tin

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Sell Flexible PCB003
Sell Flexible PCB003

Key Specifications/Special Features: Base material: polyamide Materials and thickness: 1/2, 1, 2, 3 and 5

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Sell Flexible PCB with Five-layer
Sell Flexible PCB With Five-layer

Key Specifications/Special Features: Five-layer FPC Base materials: Cu, PI and ADH Surface treatment: i

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Sell Double-layer Flexible PCB 002
Sell Double-layer Flexible PCB 002

Key Specifications/Special Features: Number of layers: double-layer Silver or EMI shielding according to

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Sell Flexible PCB005
Sell Flexible PCB005

Key Specifications/Special Features: Number of layer: single Base materials: 1oz Cu, 1mil pi and 25Î

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Sell Flexible PCB with FR4 Stiffener
Sell Flexible PCB With FR4 Stiffener

Key Specifications/Special Features: Number of layers: two Flexible foldaway space saving Stiffener: FR

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Sell PCB HDI-Plus 1 for mobile
Sell PCB HDI-Plus 1 For Mobile

Key Specifications/Special Features: Production name: 4 layers HDI Board thickness: 0.7 ± 0

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Sell 8 Layers HDI PCB for Telecom-2
Sell 8 Layers HDI PCB For Telecom-2

Key Specifications/Special Features: Layers: 8 Surface finish: ENIG+OSP Board thickness: 1.0Â&plusm

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Sell 8 Layers HDI for Mobile PCB
Sell 8 Layers HDI For Mobile PCB

Key Specifications/Special Features: Layer number: 8 Surface finished: ENIG+OSP Board thickness: 0.8mm

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8 layers PCB For Mobile Phone
8 Layers PCB For Mobile Phone

Key Specifications/Special Features: Layer No.: 8 Surface finished: ENIG + OSP Board thickness: 1.0mm A

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Sell 4L HDI PCB for Bluetooth
Sell 4L HDI PCB For Bluetooth

Key Specifications/Special Features: Layers: 4 Surface finish: EING Board thickness: 1.0+/-0.1mm Dimens

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Sell 2+N+2 HDI PCB 8L HDI PCB for Mobile
Sell 2+N+2 HDI PCB 8L HDI PCB For Mobile

Key Specifications/Special Features: Layers:8L Surface finish: ENIG+OSP Board thickness: 0.9+/-0.01mm D

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Sell HDI-Plus2 ENIG and OSP Surface Finish
Sell HDI-Plus2 ENIG And OSP Surface Finish

Key Specifications/Special Features: 8-layer copper filling HDI â¡ Internal number: HE08N20110

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Sell HDI-Plus2-for mobile
Sell HDI-Plus2-for Mobile

Key Specifications/Special Features: Eight-layers copper filling HDI Plating: copper filling Board thick

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Sell HDI-Plus1 PCB for mobile module HDI PCB with 10 Layers
Sell HDI-Plus1 PCB For Mobile Module HDI PCB With 10 Layers

Key Specifications/Special Features: Technical parameter: Board thickness: 1.0 ± 0.1mm La

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