FF-210 brightener for acid copper plating.electroplating chemicals, electroplating additives

详情

FF-210 Acidic Bright Copper Plating Process
PROPERTIES & APPLICATION:
1. Rapid depositing rate and bright plating, extremely high leveling and brightness.
2. A mirror bright deposit can be obtained in the wide range of current density, as well as extremely high leveling brightness at low current density region.
3. Wide range of working temperature, good effect can be obtained at 10-35. ℃
4. High impurity tolerance. It is not easy to produce pinholes, pits and white haze on deposit.
5. Operate easily, low brightener consumption.
6. The brightener has high stability and good compatibility. It can mix with any brightener, and change bath easily.
7. Help relieve hollow and pinhole problem.
BATH COMPOSITION & OPERATION CONDITION:
Composition
Range
Standard
Copper sulfate
180-220 g/l
180 g/l
Sulfuric acid
40-90 g/l
60 g/l
Cl-
80-100 mg/l
80 mg/l
FF-210 Make-up
4-6 ml/l
5 ml/l
FF-210 A
0.4-0.8 ml/l
0.6 ml/l
FF-210 B
0.2-0.5 ml/l
0.3 ml/l
Temp.
15-40℃
28℃
Cathodic current density
1-6 A/dm2
Anodic current density
1-3 A/dm2
Anode(phosphorus copper)
0.1-0.3%(P Assay)
Agitation
Air Agitation/Cathode Moving
Voltage
2-6V
SOLUTION PREPERATION:
1. Dissolve appropriate copper sulphate by using total volume 1/2 warm water; adjust sulphate PH value about 1.
2. Add 2g/L activated carbon, agitate for 1 hour, filter solution into bath by filter machine after long-standing.
3. Add remaining concentrated sulphuric acid into above solution while agitating, add appropriate water, agitate and cool off to room temperature.
4. Replenish hydrochloric acid to make Cl- standardized through analysis.
5. Electrolyze solution for 3-5 hours by low current.
6. Add FF-210 while agitating. After electrolyzing for few hours, then start to produce.
SOLUTION MAINTENANCE AND RAW MATERIAL FUNTION:
1. Concentration of the bath: about 20oBC at 25℃
2. Bath temperature is in the range of 10-40, choose 20℃-28.℃
3. The phosphor content of the anode is 0.1-0.3% (Using other copper anode will lead to sludge, which is very fine, difficult to filtrate and easy to bring roughness and pitting.)
4. It is better to use air agitate combining with cathode moving.
5. Copper Sulphate: is main source of copper ion. Excessive copper sulphate or low temperature will make crystal deposit on the anode. That will increase resistance, decrease current and decrease brightness and leveling in low
potential. Insufficient copper sulphate will cause burning in high potential and consume brighteners more than those in normal conditions.
6. Sulfuric acid: can increase the conductivity of bath. But excessive concentration will make copper sulphate decrease its solubility and crystallize on the anode, so that the consumption of brightener increases. Insufficient copper sulphate will cause poor brightness and leveling in low potential, bad anode soluble and great resistance.
7. Chloride ion: used as catalyzer. It neednt add when making up bath, because chloride ion in tap water will replenish. But it should be kept in the range of 60-100 ml/l. Insufficiency will lead to no brightness in high current area and tree-like stripes; excess will cause worse brightness and leveling ability.
8. FF-210 MU: used for preparing bath, changing bath or adding copper sulphate. Support brightener A and B for obtaining high leveling bright deposit and removing pinhole.
9. FF-210 A: improving plating quality in low current density region. Excessive 510A will result in producing spot and pinhole and burning at high potential area, then add 510B to balance.
10. FF-210 B: used for obtaining high leveling bright deposit.
ADDITIVE CONSUMPTION:
FF-210 Consumption (KAh)
FF-210A 50-60ml
FF-210B 40-60ml
FF-210MU 30-60ml
NORMAL TRROUBLE-SHOOTING:
Trouble
Cause of the trouble
Burn at high current density region, deposit is rough and has stripe.
1. Bath temp is too low, less than 10℃.
2. Copper sulphate is too low, less than 50g/L
3. Chloride ion is less than 20mg/L
4. 210MU is insufficient or too much 210A
5. Not agitate the mixture uniform
Poor leveling ability at low current region
1. Bath temp is too high, bigger than 35℃.
2. Low sulfuric acid content or insufficient of anode area.
3. Produce copper powder in the solution.
4. 210A is not enough.
5. Excessive chloride ion, is more than 120mg/L
Insufficient of brightness
1. Insufficient of brightener.
2. Insufficient or excessive chloride ion.
3. Insufficient of anode area
4. Conductivity property is not good
5. Sulfuric acid content is too high.
6. Pollution of organic impurities.
Big consumption of brightener
1. Temp is too high, bigger than 35℃.
2. Imbalance of the proportion of brightener
3. Too much dirt on the anode surface.
Bad adhesion of the layer
1. Too much 210A
2. Pollution of the bath
3. Using polluted water
4. Acidwashing and activation is not good.
Anode Passivation
1. Sulfuric acid content is too high
2. Chloride ion content is excessive.
3. Anode bag is blocked
4. Solution is polluted by Fe impurities, resulting in high specific weight

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