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HUIZHOU HEXINDA ELECTRONICS ,LTD

jinji,huizhou,guangdong,China China

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主页 公司名称 HUIZHOU HEXINDA ELECTRONICS ,LTD 产品

产品: 5

extra thinness micro hole multiplayer
Extra thinness micro hole multiplayer

Technical data: Surface coating: gold platting , H.A.L, immersion tin, immersion gold, OSP, lead free HAL, immersion silver. Used material: FR4, CEM

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PMP-multilayer immersion gold
PMP-multilayer immersion gold

technical data: Surface disposition:gold platting,H.A.L,immersion tin,immersion gold,OSP,gymno-copper. Max-layer:8 Max-process size:53cm*48cm

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OSP process
OSP process

technical data: Surface disposition:gold platting,H.A.L,immersion tin,immersion gold,OSP,gymno-copper. Max-layer:8 Max-process size:53cm*48cm

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high voltage double sided
High voltage double sided

Technical data: Surface coating: gold platting , H.A.L, immersion tin, immersion gold, OSP, lead free HAL, immersion silver. Used material: FR4, CEM

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printed circuit board
Printed circuit board

Technical data: Surface coating: gold platting , H.A.L, immersion tin, immersion gold, OSP, lead free HAL, immersion silver. Used material: FR4, CEM

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Ms. cinderella < HUIZHOU HEXINDA ELECTRONICS ,LTD >
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