联系人 Ms. Daisy
Building B8, Industry District II, Xicheng, Hengli Township, Dongguan City, Guangdong Province, Dongguan, Guangdong
The TIC™**0A
Series is low melting point thermal
interface material. At *0℃, The TIC™**0A Series begins to
soften and flow, filling the microscopic irregularities of
both the thermal solution and the integrated circuit package
surface, thereby reducing thermal resistance.The TIC™**0A
Series is a flexible solid at room temperature and
freestanding without reinforcing components that reduce
thermal performance.
The TIC™**0A
Series shows no thermal performance degradation
after 1,**0 after **0 cycles, from **5℃ to
**5℃.The material softens and does not fully change state
resulting in minimal migration (pump out)at operating
temperatures.
Features
》0.**0℃-in² /W thermal resistance
》Naturally tacky at room temperature, no adhesive
required
》No heat sink preheating required
Applications
》High Frequency Microprocessors
》Notebook and Desktop PCs
》Computer Serves
》Memory Modules
》Cache Chips
》IGBTs
| Typical Properties of TIC™**0A Series | ||||||||||||||||||||||
|
Product
Name
|
TICTM**3A
|
TICTM**5A
|
TICTM**8A
|
TICTM**0A
|
Testing
standards
|
|||||||||||||||||
|
Color
|
Ashy
|
Ashy
|
Ashy
|
Ashy
|
Visual
|
|||||||||||||||||
|
Composite
Thickness
|
0.**3"
(0.**6mm) |
0.**5"
(0.**6mm) |
0.**8"
(0.**3mm) |
0.**0"
(0.**4mm) |
|
|||||||||||||||||
|
Thickness
Tolerance
|
±0.***6"
(±0.**6mm) |
±0.***8"
(±0.**9mm) |
±0.***8"
(±0.**9mm) |
±0.***2"
(±0.**0mm) |
|
|||||||||||||||||
|
Density
|
2.5g/cc
|
Helium Pycnometer
|
||||||||||||||||||||
|
Work
Temperature
|
**5℃～**5℃
|
|
||||||||||||||||||||
|
phase
transition temperature
|
*0℃~*0℃
|
|
||||||||||||||||||||
|
Setting
temperature
|
*0℃ for 5
minutes
|
|
||||||||||||||||||||
|
Thermal
conductivity
|
2.5 W/mK
|
ASTM D***0
(modified)
|
||||||||||||||||||||
|
Thermal
lmpedance
相关产品 Dongguan Ziitek Electronic Materials相关产品Send a direct inquiry to this supplierGet Verified Buyers & SuppliersAvail Free Consultation | ||||||||||||||||||||||
