联系人 Ms. Daisy
Building B8, Industry District II, Xicheng, Hengli Township, Dongguan City, Guangdong Province, Dongguan, Guangdong
The
TIG™*****5 products are the high-efficiency heat
dissipation ones for the fillings between the electronic components
and the heat dissipation fins. They serve to moisten the contact
surface sufficiently so as to form an interface of extremely low
thermal impedance. Consequently, the heat dissipation efficiency is
far superior to that offered by others.
For Lowest Thermal
Resistance
》0.*5℃-in²/W thermal resistance
》One component paste like interface material, never dry
》Thermal compound formulated to maximize the heat transfer
》Outstanding electrical insulation properties and will not harden
on long exposure to elevated temperatures
》Non-toxic and environmentally safe
Applications
lnclude
》Semiconductor cases and heat sinks
》Power resistors and chassis, thermostats and mating surfaces, and
thermoelectric cooling devices
》CPU's and GPU's
》Automatic dispensing and screen-printing
| 国家: | China |
| 型号: | - |
| 离岸价格: | 获取最新报价 |
| 位置: | - |
| 最小订单价格: | - |
| 最小订单: | - |
| 包装细节: | - |
| 交货时间: | - |
| 供应能力: | - |
| 付款方式: | - |
| 產品組 : | TIG |
