联系人 Ms. Daisy
Building B8, Industry District II, Xicheng, Hengli Township, Dongguan City, Guangdong Province, Dongguan, Guangdong
The TIA™**0FG
Series products are mostly used for bonding heat
dissipation fins, microprocessors and other power consumption
semiconductors. This type of adhesive tape possesses ultimate
bonding strength with low thermal impedance, with which in effect
can be able to replace the method of lubricating grease and
mechanical fixing.
Features
》Thermal Conductivity: 0.8 W/mK
》High bond strength to a variety of surfaces double sided pressure
sensitive adhesive tape
》High performance, thermally conductive acrylic adhesive
Applications
》Mount heat sink onto BGA graphic processor or drive processor
》Mount heat spreader onto power converter PCB or onto motor control
PCB
》High performance, thermally conductive acrylic adhesive
》Can be used instead of heat cure adhesive,screw mounting or clip
mounting
Standard
Thicknesses:
0.**5"(0.**7mm)
0.**6"(0.**2mm)
0.**8"(0.**3mm)
0.**0"(0.**4mm)
0.**5"(0.**1mm)
0.**0"(0.**8mm)
Consult the factory alternate thickness.
Standard Sizes:
*0" x *8"(**4mm x **7mm) *0" x **0'(**4mm x
**1.9M)
Individual die cut shapes can be supplied.
Reinforcement:
TIA™**0 Series sheets are fiberglass reinforced.
| 国家: | China |
| 型号: | TIA800FG |
| 离岸价格: | 获取最新报价 |
| 位置: | - |
| 最小订单价格: | - |
| 最小订单: | 50 Roll |
| 包装细节: | 100Roll/bag |
| 交货时间: | 2-3DAYS |
| 供应能力: | - |
| 付款方式: | T/T |
| 產品組 : | TIA |
